Day: March 4, 2025

Nyxoah to Participate in the Oppenheimer 35^th Annual Healthcare MedTech & Services Conference

Mont-Saint-Guibert, Belgium – March 3, 2025, 10:30pm CET / 4:30pm ET – Nyxoah SA (Euronext Brussels/Nasdaq: NYXH) (“Nyxoah” or the “Company”), that develops breakthrough treatment alternatives for Obstructive Sleep Apnea (OSA) through neuromodulation, today announced that the Company will participate in the Oppenheimer 35^th Annual Healthcare MedTech & Services Conference, which takes place March 17 – 20, 2025.

Olivier Taelman, Nyxoah’s Chief Executive Officer, will deliver a corporate presentation on Monday, March 17, 2025, at 8:40am ET. A webcast of the presentation will be available in the Events section of Nyxoah’s Investor Relations website. The Company will be available for 1×1 meetings with institutional investors.

Nyxoah’s Investor Presentation can be accessed on the Shareholder Information section of the Company’s
Investor Relations page.

About Nyxoah
Nyxoah is reinventing sleep for the billion people that suffer from obstructive sleep apnea (OSA). We are a medical technology company that develops breakthrough treatment alternatives for OSA through neuromodulation. Our first innovation is Genio®, a battery-free hypoglossal neuromodulation device that is inserted through a single incision under the chin and controlled by a wearable. Through our commitment to innovation and clinical evidence, we have shown best-in-class outcomes for reducing OSA burden.

Following the successful completion of the BLAST OSA study, the Genio® system received its European CE Mark in 2019. Nyxoah completed two successful IPOs: on Euronext Brussels in September 2020 and NASDAQ in July 2021. Following the positive outcomes of the BETTER SLEEP study, Nyxoah received CE mark approval for the expansion of its therapeutic indications to Complete Concentric Collapse (CCC) patients, currently contraindicated in competitors’ therapy. Additionally, the Company announced positive outcomes from the DREAM IDE pivotal study for FDA and U.S. commercialization approval.

For more information, please visit http://www.nyxoah.com/.

Caution – CE marked since 2019. Investigational device in the United States. Limited by U.S. federal law to investigational use in the United States.

Contacts:

Nyxoah
John Landry, CFO
[email protected]

Attachment

• ENGLISH_Oppenheimer Press Release_FINAL

GlobeNewswire Distribution ID 1001051595

                                                                  Tune Talk MOA with Mavenir

BARCELONA, Spain, March 04, 2025 (GLOBE NEWSWIRE) — Tune Talk, Malaysia’s fastest-growing digital telco, has signed a Memorandum of Agreement (MOA) with Mavenir, the cloud-native network infrastructure provider, to provide a cutting-edge Cloud-Native Digital Operations Support System (OSS) and Business Support System (BSS) platform. The announcement was made at Mobile World Congress (MWC) 2025 in Barcelona, reinforcing Tune Talk’s commitment to technological innovation and enhanced customer experience.

The cloud-native OSS/BSS platform is designed to enable Tune Talk to implement self-healing and automatic scaling capabilities, significantly improving operational efficiency. With zero-touch operations, the platform is designed to streamline network management, reduce downtime, and enhance service reliability. Additionally, AI-driven tools will revolutionize customer engagement, offering hyper-personalized services tailored to individual subscriber needs.

“This partnership with Mavenir marks a significant step in our digital transformation journey. By leveraging cloud-native and AI-powered solutions, we are not only optimizing our operations but also enhancing our ability to deliver superior and highly personalized services to our customers,” said Gurtaj Singh Padda, Executive Director and CEO of Tune Talk. “This move aligns with our vision of making digital connectivity more seamless and intelligent for all Malaysians.”

Echoing this sentiment, Jay Pandey, Chief Technology Officer of Tune Talk, highlighted the operational efficiencies that this collaboration will bring: “With Mavenir’s cloud-native solutions, we expect to increase our operational efficiency by 60 to 70%. Network performance will see fewer interruptions, ensuring low latency and a more seamless experience for our subscribers. This partnership represents a transformative step in our technology processes, making our network smarter and more resilient than ever before.”

Pardeep Kohli, President and CEO at Mavenir, also expressed enthusiasm for the strategic partnership: “We fully support Tune Talk’s efforts in becoming a cloud mobile network operator. Our cloud-native OSS/BSS platform is designed to enable Tune Talk to operate with greater agility, efficiency, and automation, setting a new standard for digital-first telco services in Malaysia and beyond. We look forward to driving this transformation together.”

The implementation of this next-generation platform is expected to set a new benchmark in Malaysia’s telecommunications industry. By automating network operations and leveraging AI for predictive analytics, Tune Talk aims to improve network performance and customer satisfaction while reducing operational costs. This initiative also strengthens Malaysia’s position in the global digital economy, fostering innovation in the telco sector and setting a precedent for cloud-native adoption in the region.

As digital transformation accelerates, the collaboration between Tune Talk and Mavenir is poised to redefine telco service delivery, bringing cutting-edge advancements to Malaysian consumers and the broader industry.

About Tune Talk

Tune Talk is the fastest-growing fully cloud-enabled Mobile Network Operator in Asia. Since our launch in 2009, we have remained committed to offering affordable rates and exciting incentives. As a digital lifestyle telecommunications company, our services include unlimited calls, SMS, and high-speed internet packages, tailored to meet the demands for simple, value-driven products with easy accessibility and wide distribution. Our focus on innovation and digital disruption drives us to continuously provide cutting-edge telecommunication solutions, meeting the evolving needs of our customers and keeping us at the forefront of the industry.

For more information, please visit www.tunetalk.com.

About Mavenir:

Mavenir is building the future of networks today with cloud-native, AI-enabled solutions which are green by design, empowering operators to realize the benefits of 5G and achieve intelligent, automated, programmable networks. As the pioneer of Open RAN and a proven industry disruptor, Mavenir’s award-winning solutions are delivering automation and monetization across mobile networks globally, accelerating software network transformation for 300+ Communications Service Providers in over 120 countries, which serve more than 50% of the world’s subscribers. For more information, please visit www.mavenir.com

PR Contacts: Mavenir: Emmanuela Spiteri | [email protected]

A photo accompanying this announcement is available at https://www.globenewswire.com/NewsRoom/AttachmentNg/3ec6ad0e-db50-409f-be25-495db047d71c

GlobeNewswire Distribution ID 9388263

With a mission to revolutionize the staffing industry, Temp Connect launches globally, offering innovative solutions for a modern workforce

DENVER, March 04, 2025 (GLOBE NEWSWIRE) — Temp Connect, a groundbreaking platform designed to redefine staffing, proudly announces its global launch. Temp Connect bridges the gap between employers and job seekers, creating a streamlined hiring process for temporary and permanent roles worldwide, emphasizing efficiency and transparency.

Driving Global Impact:

As the job market evolves with more remote work, gig opportunities, and global hiring, Temp Connect provides a seamless and adaptable platform that simplifies the hiring process for employers and job seekers alike.

By eliminating barriers that have long hindered traditional staffing practices, Temp Connect empowers businesses to connect with talent pools while providing job seekers with more significant opportunities.

Innovative Features:

Temp Connect stands out with its user-friendly design and cutting-edge technology, offering a seamless experience for both employers and job seekers:

• Flexible and Affordable Job Postings: Employers receive one free job posting and can choose from cost-effective plans tailored to their hiring needs.
• 30-Day Job Listings: Every job post remains active for a month, maximizing visibility and increasing the chances of finding the right match.
• Instant Job Matching: Advanced algorithms quickly connect employers with qualified candidates, reducing hiring time.
• Real-Time Notifications: Job seekers receive instant alerts about new opportunities, ensuring they never miss a potential job.
• Time Clock Manager: An integrated time-tracking system helps businesses manage temporary workers efficiently, simplifying payroll and timekeeping.
• User-Friendly Dashboard: Employers and job seekers can easily manage applications, job postings, and connections through an intuitive interface.

These features make hiring and job searching faster, more innovative, and more efficient, creating meaningful connections across industries and regions.

The Vision Behind Temp Connect:

Temp Connect’s foundation lies in its mission to revolutionize the staffing industry. Inspired by personal experiences in the workforce, founder Christina Smith created the platform to address inefficiencies and unfair practices in traditional staffing.

“Temp Connect is about more than just finding jobs or hiring talent—it’s about building a system that works for everyone,” Christina explains. “We aim to bring the same transformative change to staffing as Uber and Lyft did to ridesharing.”

Milestones and Growth:

Since its inception, Temp Connect has grown from a bold idea to a global platform, connecting thousands of employers and job seekers. This global launch represents a significant milestone in the company’s journey, marking the beginning of an era where technology redefines the workforce.

Temp Connect invites employers and job seekers to join the movement and experience a better way to connect and work. Visit www.tempconnect.app to learn more about the platform and its features.

Temp Connect isn’t just changing the staffing industry—it’s shaping the future of work. With a commitment to innovation, accessibility, and efficiency, Temp Connect redefines how the world connects and works.

Temp Connect is a global workforce platform revolutionizing how businesses hire, and job seekers find work. Designed for speed, efficiency, and accessibility, Temp Connect streamlines the hiring process with flexible job postings, real-time job matching, and built-in time tracking. By eliminating traditional staffing barriers, the platform empowers businesses to connect with qualified talent faster and helps workers access more job opportunities. Whether for temporary, gig, or permanent roles, Temp Connect is shaping the future of staffing.

Learn more at www.tempconnect.app.

Media Contact:

Christina Smith, Founder
(303) 667-7379
[email protected]

GlobeNewswire Distribution ID 9385720

Team delivers winning logical data management solution in support of improving life expectancy

PALO ALTO, Calif., March 04, 2025 (GLOBE NEWSWIRE) — Denodo, a leader in data management, announced that the winner of the latest Denodo University Challenge, Data for Social Change: Improve Life Expectancy, is the Data Shoe team from Dauphine University, in Paris, France, with members Dounia Bouloudene (captain), Nassim Fatmi, and Youcef Azouaoui (The page hyperlinked above includes a video, supplied by Data Shoe, that showcases the winning solution). Additionally, the Universidade da A Coruña, in Spain, was awarded a prize for contributing the most teams to this competition.

The Denodo Academic Program prepares students through virtual, self-paced training modules, live workshops, and a free version of the Denodo Platform. The latest University Challenge, announced in September of last year, put teams of students through the paces as they raced to build the most effective solution for leveraging data and analytics to improve ESG practices and ultimately life expectancy.

The Data for Social Change: Improve Life Expectancy challenge required students to integrate views of data sources, both supplied and student-identified, to correlate life expectancy with a variety of factors and draw conclusions. The challenge required students to analyze the data using reporting and/or visualization tools and build graphs and other representations to present their findings.

The winning team, Data Shoe, demonstrated that improving healthcare access, reducing air pollution, and fostering political stability are critical to the improvement of life expectancy, and that advancing public policies in these areas can drive not only significant social progress, but also better quality of life, globally. To solve this Challenge, the Data Shoe team identified, accessed, and integrated publicly available data related to air pollution and political stability.

The judges also determined that Data Shoe did an excellent job of explaining the metadata created in the Denodo Platform using the Denodo Design Studio and providing a clear narrative in their Microsoft Power BI report, along with easy-to-understand visuals. The team’s conclusions were well supported by their analysis.

Dounia spoke for the whole team when she said, “The Denodo University Challenge taught us how to think strategically about solving complex data integration problems by efficiently using the Denodo Platform, with the aim of retrieving relevant insights from raw data. Our biggest challenges were choosing the best way to optimize our approach and finding the most valuable data sources, but teamwork and perseverance allowed us to overcome them.”

“I was extremely proud of the level of professionalism that the Data Shoe team brought to this competition,” said Alberto Pan, chief technology officer at Denodo. “Working together, they demonstrated the importance of good data, enhanced through a semantic layer, to answer questions about longevity in a clear, defensible way. The Denodo Platform’s logical data management capabilities, such as support for low code/no code development, makes it easy for students and those without extensive data management experience to rapidly learn the platform and develop solutions. The Data Shoe team leveraged these capabilities to quickly build a robust, well-designed solution.”

The next Denodo University Challenge, focused on AI, is open for pre-registration starting today.

Media Contacts
[email protected]

About Denodo
Denodo is a leader in data management. The award-winning Denodo Platform is the leading logical data management platform for delivering data in the language of business, at the speed of business, for all data-related initiatives across the organization. Realizing more than 400% ROI and millions of dollars in benefits, Denodo’s customers across enterprises in 30+ industries all over the world have received payback in less than six months. For more information, visit denodo.com.

GlobeNewswire Distribution ID 9388502

Advanced Open-Q SoMs Accelerate AI-Powered Visual Navigation in Drones, Robotics and Surveillance Applications

IRVINE, Calif., March 04, 2025 (GLOBE NEWSWIRE) — Lantronix Inc.  (NASDAQ: LTRX), a global leader of compute and connectivity for IoT solutions enabling AI Edge Intelligence, today announced a breakthrough in AI-powered camera technology with the seamless integration of its high-performance Open-Q System-on-Module (SoM) solutions including hardware and software with Teledyne FLIR’s thermal infrared (IR) camera modules and Prism embedded software. This integration accelerates the development of next-generation AI-enabled camera solutions in autonomous navigation/drones, surveillance and robotics.

Powered by Lantronix’s cutting-edge Open-Q SoMs, based on the Qualcomm Dragonwing QRB5165 and QCS8250 processor platforms, this solution delivers unparalleled processing capabilities for AI-driven situational awareness, advanced computational imaging and real-time decision-making. Lantronix’s seamless technology integration provides a competitive edge, enabling developers to create high-performance, size-, weight- and power-optimized (SWaP) AI camera solutions that push the boundaries of innovation.

Lantronix at the Forefront of AI Edge Intelligence

“With Lantronix’s Open-Q SoMs, developers can confidently build AI-powered solutions knowing they are backed by industry-leading embedded compute technologies that deliver longevity, reliability and continuous innovation,” said Mathi Gurusamy, Chief Strategy Officer at Lantronix. “By integrating with Teledyne FLIR’s advanced thermal camera modules, Lantronix provides a turnkey embedded AI solution that maximizes performance while simplifying development and deployment,” he added.

Advanced AI and Thermal Processing

Lantronix’s integration of Teledyne FLIR Prism into the Qualcomm Dragonwing QRB5165 and QCS8250 platforms brings advanced thermal image signal processing (ISP) and AI capabilities to edge devices. Key features include:

• Prism ISP: Super resolution, turbulence mitigation, atmospheric obscurant correction, de-noising, image fusion, electronic stabilization, and local contrast enhancement.
• Prism AI: Real-time object detection, motion target indication, and high-speed target tracking at video frame rates.

Lantronix’s Open-Q SoMs fully support Teledyne FLIR Hadron dual visible-thermal and Boson® thermal camera modules, allowing for simultaneous color and infrared video capture across multiple MIPI-CSI camera interfaces. Key configurations include:

• Hadron Camera: Integrated with the Lantronix Open-Q 8250 SoM, featuring the Dragonwing QCS8250 processor running Android.
• Boson Camera: Integrated with the Lantronix ultra-compact Open-Q 5165 SoM, leveraging the Dragonwing QRB5165 platform on Linux®.

Teledyne FLIR on the Lantronix Collaboration

“Our collaboration with Lantronix adds flexibility for integrators developing thermal-enabled AI-based platforms,” said Michael Walters, Vice President of Product Management at Teledyne FLIR OEM. “Our SWaP-optimized IR camera modules and ultra-low embedded software processing power simplify thermal management and extend battery life for autonomy applications.”

Lantronix Open-Q 5165: Optimized for AI and Edge Computing

Lantronix’s Open-Q 5165 is an ultra-compact (50mm x 29mm), production-ready, pre-certified SoM based on the powerful Dragonwing QRB5165 platform. Features include:

• Qualcomm Spectra ISP, Qualcomm® Adreno GPU, and Qualcomm® Hexagon DSP
• 5^th generation Qualcomm® AI Engine, with twice the performance of the previous generation, with up to 15 trillion operations per second
• Wi-Fi 6 connectivity, advanced camera features and many high-speed interfaces

Lantronix will display its SoMs in the Qualcomm Technologies booth at Hall5/5-161 at Embedded World, March 13–15, 2025, in Nuremberg, Germany.

About Lantronix

Lantronix Inc. is a global leader of compute and connectivity IoT solutions that target high-growth markets, including Smart Cities, Enterprise and Transportation. Lantronix’s products and services empower companies to succeed in the growing IoT markets by delivering customizable solutions that enable AI Edge Intelligence. Lantronix’s advanced solutions include Intelligent Substations infrastructure, Infotainment systems and Video Surveillance, supplemented with advanced Out-of-Band Management (OOB) for Cloud and Edge Computing.

For more information, visit the Lantronix website.

Lantronix Media Contact:
Gail Kathryn Miller
Corporate Marketing &
Communications Manager
[email protected]

Lantronix Analyst and Investor Contact:
[email protected]

©2025 Lantronix, Inc. All rights reserved. Lantronix is a registered trademark. Other trademarks and trade names are those of their respective owners.

Snapdragon and Qualcomm branded products are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Qualcomm, Qualcomm Dragonwing, Qualcomm Spectra, Snapdragon, Adreno and Hexagon are trademarks or registered trademarks of Qualcomm Incorporated.

GlobeNewswire Distribution ID 9387468

AUSTIN, Texas, March 04, 2025 (GLOBE NEWSWIRE) — Ambiq^®, a leading provider of ultra-low-power semiconductor solutions that address the significant power consumption challenges of conventional and AI compute at the edge, unveils the Apollo330 Plus System-on-Chip (SoC) series. The series consists of the base Apollo330 Plus, the Apollo330B Plus, and the Apollo330M Plus, each offering a rich set of peripherals and connectivity options for healthcare, smart homes and buildings, industrial edge applications, and more to drive always-on and real-time AI at the edge.

Key Features:

• Up to 250 MHz Arm^® Cortex ^®-M55 application processor with turboSPOT^® and Arm^® Helium technology
• 48/96 MHz Arm Cortex-M4F network processor and multi-protocol radio (in wireless product options)
• Over 16x faster performance and lower latency, and 30x better AI energy efficiency than similar solutions based on previous generation Cortex-M processors
• Ultra-low power digital microphone PDM for truly always-on voice
• Multiple package and connectivity options such as Bluetooth^® Low Energy, Matter, and Thread for diverse edge devices

The Apollo330 Plus series is purpose-built to enable always-on and real-time AI inferencing on devices. Built on Ambiq’s proprietary subthreshold power optimized technology (SPOT^®) platform, it achieves unprecedented 16x faster performance and up to 30x better AI energy efficiency compared to similar solutions based on previous generation Cortex-M processors, so manufacturers can deliver innovative features while extending device lifetimes, offering multi-protocol connectivity across diverse endpoints, and enhancing user experiences.

The Apollo330 Plus architecture fully leverages the Arm Cortex-M55 processor with Arm Helium technology for AI acceleration, processing up to 8 MACs per cycle. The Apollo330 Plus series includes 2MB of on-chip system RAM, 2MB of embedded non-volatile memory, a large 32kB I-cache and 32kB D-cache on a wide bus, and a multi-protocol radio for developers to create high-performing and power-efficient products.

“While today’s smart devices rely heavily on power-hungry cloud computing, the Apollo330 Plus series creates a brand-new opportunity by enabling true edge AI processing,” says Fumihide Esaka, CEO of Ambiq. “This empowers manufacturers to create longer-lasting, more responsive, intelligent devices for homes, offices, and factories.”

“With a growing number of new and compelling edge AI applications emerging across markets including industrial and smart home, enabling ultra-low-power AI processing directly at the edge will be transformative,” said Laurence Bryant, VP segment marketing, IoT Line of Business at Arm. “With this new solution, built on Arm, Ambiq is paving the way for smarter, more efficient devices that can deliver real-time intelligence across a wide range of use cases.”

The Apollo330 Plus series offers three variants:

• The Apollo330 Plus base model without wireless connectivity offers a rich set of peripherals for wearables, medical/healthcare, and smart home, empowering developers to create sophisticated sensor-based applications easily.
• The Apollo330B Plus extends upon the Apollo330 Plus with Bluetooth^® Low Energy (BLE) support for a wide selection of connected peripherals and audio applications
• The Apollo330M Plus further adds multi-protocol radio support for IEEE 802.15.4, Thread, and Matter, enabling low-power interoperability mesh networking between next-gen smart home, smart meter, and industrial edge devices

Its streamlined multi-core architecture comprises a powerful application processor and a dedicated network co-processor for uncompromised radio performance. The design simplifies development while delivering uncompromised multi-protocol radio performance with robust signal strength up to +14dBm signal strength and enhanced radio sensitivity.

Innovative secureSPOT^® 3.0 features based on Arm TrustZone^® technology further enhance Apollo330 Plus Series SoCs, ensuring the integrity and confidentiality of data transmitted and processed by connected devices. With hardware-based security mechanisms, such as secure boot and secure firmware updates, these SoCs provide robust protection against unauthorized access and malicious attacks, enabling secure deployment in various applications.

As the newest addition to Ambiq’s portfolio, the Apollo330 Plus SoC series sets a new standard for ultra-low-power AI processing at the edge. With more connectivity, security, a wider set of peripheral interfaces, and multiple package options, these SoCs provide developers with the tools they need to implement sophisticated, energy-efficient AI solutions in edge devices.

Check out the Apollo330 Plus SoC Series, and visit Ambiq at Embedded World 2025 by booking a meeting with their team.

About Ambiq

Our mission is to enable intelligence (artificial intelligence (AI) and beyond) everywhere by delivering the lowest power semiconductor solutions. We enable our customers to deliver artificial intelligence compute at the edge where power consumption challenges are the most profound. Our technology innovations, built on the patented and proprietary subthreshold power optimized technology (SPOT), fundamentally deliver a multi-fold improvement in power consumption over traditional semiconductor designs. We’ve powered over 260 million devices today. For more information, visit www.ambiq.com.

Contact

Charlene Wan
VP of Branding, Marketing, and Investor Relations
[email protected]
+1.512.879.2850

A photo accompanying this announcement is available at https://www.globenewswire.com/NewsRoom/AttachmentNg/caa4645a-4944-4bf7-b13b-0a3177b7d62c

GlobeNewswire Distribution ID 9388378